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硅片切割機-Wafer cutting machine

硅片是非常硬質的材料,高密度的硅片需要通過專業設備切割后才能正常使用,切割硅片需要使用金剛拉絲的金剛切割機。大體量的設備不僅要使用水,而且要使用金鋼絲作為切割的工具。從外觀到結構的設計有許多要求和限制,比如說設備上料及操作的便利性,整機外圍的防水都有較高的要求。

HURAKAN從產品外觀設計將其與傳統銑削機床設備做了區分,產品配色及外部標識與傳統大型機床設備也做了區分;結構設計師仔細分析了每個操作區域的結構方式,保證了產品加工狀態可觀察,上料方便及整機外圍的密封性。

Silicon wafer is a very hard material, high density silicon wafer needs to be cut through professional equipment before normal use, cutting silicon wafer need to use diamond wire diamond cutting machine. Large volumes of equipment should use not only water but also gold wire as a cutting tool. From the appearance to the design of the structure there are many requirements and restrictions, such as the equipment on the material and the convenience of operation, the outer waterproof machine have higher requirements.

HURAKAN distinguishes itself from traditional milling machine tools and equipment in terms of product appearance design, and also distinguishes itself from traditional large-scale machine tools and equipment in terms of product color matching and external identification. The structural designer carefully analyzed the structural mode of each operation area to ensure that the product processing state can be observed, feeding is convenient and the sealing of the periphery of the machine.

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