Silicon wafer is a very hard material, high density silicon wafer needs to be cut through professional equipment before normal use, cutting silicon wafer need to use diamond wire diamond cutting machine. Large volumes of equipment should use not only water but also gold wire as a cutting tool. From the appearance to the design of the structure there are many requirements and restrictions, such as the equipment on the material and the convenience of operation, the outer waterproof machine have higher requirements.
HURAKAN distinguishes itself from traditional milling machine tools and equipment in terms of product appearance design, and also distinguishes itself from traditional large-scale machine tools and equipment in terms of product color matching and external identification. The structural designer carefully analyzed the structural mode of each operation area to ensure that the product processing state can be observed, feeding is convenient and the sealing of the periphery of the machine.